To provide a filmy adhesive which is applicable to a flip chip connection method, and a production method of a semiconductor device using the filmy adhesive.
The filmy adhesive 10 contains: (a) a resin whose weight average molecular weight is less than 10,000 and which takes on a solid form at ordinary temperature (25°C); (b) an insulating spherical inorganic filler; (c) an epoxy resin (however, when the component (a) is an epoxy resin, the component (c) is an epoxy resin different from the component (a)); and (d) a hardener, wherein the minimum melting viscosity at a temperature of 50-250°C is more than 200 Pa s, a flow amount which is a ratio of an initial area of the filmy adhesive 10 inserted between parallel plates and heated/pressurized at 50-150°C and an area after heating/pressurizing is 1.5 or more, and a mean linear expansion coefficient of a hardened product thereof is 200×10-6/°C or less at 25-260°C, and the hardener (d) contains imidazoles having a melting point or a decomposition point of 150°C or more and a microencapsulated hardener.
NAGAI AKIRA
AICHI KATSUHIDE
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Yoshinori Shimizu
Hiroyuki Hirano