To provide a fine-particle holding plate that can hold fine particles in a state where the particles are highly densely arranged at narrow intervals and is improved in reliability, by preventing the occurrence of defective holding by strengthening the suction force used at the time of sucking the particles, and to provide a method of manufacturing the plate.

This fine-particle holding plate is manufactured through a step of patterning a nonconductive material on a silicon substrate on which conductive films 13 are formed, a step of forming metallic members 11 on the conductive films 13 by electroforming by utilizing the patterned nonconductive material as a mold, and a step of wet-etching prescribed portions of the silicon substrate by utilizing the metallic members as masks. In this plate, through holes having square inner peripheral shapes and sidewalls inclined from a horizontal plane by about 55° and through holes having circular inner peripheral shapes and vertical side walls are continuously formed on straight lines.