To provide a fine particle for a semiconductor sealing material in which the internal stresses at the contact interface of a semiconductor element and a cured body of a resin composition for sealing can be reduced and which has excellent dispersibility in the resin composition for sealing and which can further give cured bodies of the resin composition for sealing that may ensure high light transmission and sufficient luminance when used in sealing of an optical semiconductor element, and to obtain a resin composition for sealing a semiconductor.
The fine particle for the semiconductor sealing material according to the present invention is characterized in that it is composed of a silica particle in which an organic group is bonded to at least a part of the surface of the silica particle. The resin composition for sealing the semiconductor according to the present invention is characterized in that it comprises the resin and the above fine particles for the semiconductor sealing material according to the present invention.
KURAMOTO SHIGEFUMI
SASAKI NORIKUNI
