Title:
FINE WIRE FEEDING SPOOL
Document Type and Number:
Japanese Patent JP2940425
Kind Code:
B2
Abstract:
PURPOSE: To provide a fine wire feeding spool that is able to make all required spots into being conductivity with inexpensive manufacturing cost, and sufficient corrosion resistance inherent in itself.
CONSTITUTION: A flange is formed at both ends in the axial direction of an A1 spool body formed into tubularity, while a fine wire 4 is opposedly supported in contact at one end of the spool body as rolled on this spool body, and the other end side is rewound out of the spool body, and thus the wire 4 is fed to a wire bonder where wire bonding of a semiconductor element is carried out. Coating thickness of anodization on both inner and outer walls of the spool body is set to 0.01μm to 0.5μm at a contact part between the opposed supporting part of the fine wire 4 of the spool body and a spool holder 6 of this wire 4, and in this case, a treated coat is of conductive in structure, and with current energization of the fine wire 4, the spool holder 6 at the other end of the spool body and the wire bonder, a supply of the fine wire 4 can be done as monitoring any disconnection of the fine wire 4, through which there is anticorrosiveness and it is also advantageous from the standpoint of manufacturing cost.
Inventors:
TOGASHI AKIRA
Application Number:
JP33442894A
Publication Date:
August 25, 1999
Filing Date:
December 19, 1994
Export Citation:
Assignee:
SUMITOMO KINZOKU KOZAN KK
International Classes:
B65H75/14; B65H57/18; B65H75/18; H01L21/60; (IPC1-7): B65H75/14; B65H75/18; H01L21/60
Domestic Patent References:
| JP6241782U |
Attorney, Agent or Firm:
Yoshihisa Oshida