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Patent Searching and Data


Title:
FINE WIRE PATTERN AND FINE WIRE PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2018180741
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a fine wire pattern and a fine wire pattern forming method that are excellent in low visibility of fine wire patterns formed on both sides of a transparent base material.SOLUTION: The fine wire pattern includes a first fine wire pattern 2 provided on one surface of a transparent substrate 1 and a second fine wire pattern 3 provided on the other surface, in which the first and second fine wire patterns 2 and 3 are composed of a plurality of rectangular fine wires 21 and 31 made of a functional material arranged two-dimensionally in parallel in directions of two diagonal lines of the rectangular fine wires 21 and 31 in which adjacent rectangular fine wires 21 and 31 intersect at two intersecting points to make both sides sandwiching the apex intersected with each other, so that two diagonal lines of the rectangular fine wire 21 of the first fine wire pattern 2 and two diagonal lines of the rectangular fine wire 31 of the second fine wire pattern 3 are inclined with each other. There is also provided the fine wire pattern forming method which makes the two diagonal lines of the rectangular fine wire 21 of the first fine wire pattern 2 and the two diagonal lines of the rectangular fine wire 31 of the second fine wire pattern 3 incline with each other.SELECTED DRAWING: Figure 2

Inventors:
NIIZUMA NAOTO
OYA HIDENOBU
YAMAUCHI MASAYOSHI
OMATA TAKENORI
HOSHINO HIDEKI
URAYAMA KAZUHO
Application Number:
JP2017076312A
Publication Date:
November 15, 2018
Filing Date:
April 06, 2017
Export Citation:
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Assignee:
KONICA MINOLTA INC
International Classes:
G06F3/041; G06F3/044; H01B5/14; H01B13/00; H05B3/10; H05B3/16; H05B3/20; H05B3/84
Attorney, Agent or Firm:
Eiichi Maruyama