PURPOSE: To facilitate packaging work by packaging metal memorizing a shape previously and dumping in an easy-to-package state, and positioning the metal in the specific memorized shape through a heat treatment.

CONSTITUTION: The shape memory alloy which is normally linear, but restores itself into a spring shape by being heated is used to obtain lead wires 7 and 8. Those lead wires 7 and 8 are soldered to a printed circuit board 9 and heated properly to enter a state shown in a figure; the lead wires 7 and 8 contact the printed circuit board 9 or hold themselves steady at desired positions without using any special packaging means. Thus, the packaging is facilitated because the shape memory metal returns into the predetermined shape and hold itself at a desired position and in a desired state.