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Title:
FIXING MEMBER
Document Type and Number:
Japanese Patent JP2012059869
Kind Code:
A
Abstract:

To provide a fixing member used for fixing a semiconductor element to a substrate circuit by compression bonding.

The body part of a cylindrical elastic core body 1 is wound with 30-500 turns of a fibrous heat shrinkage continuous body 2 in coil-shape, excepting within 0.2 mm at both ends of the body part of the elastic core body 1. Diameter at the body part of the cylindrical elastic core body 1 in the longitudinal central part thereof is 10-70% of the average diameter at both ends of the cylindrical elastic core body 1. The fibrous heat shrinkage continuous body 2 is thermally shrunk to fasten the cylindrical elastic core body 1 in the body core direction and the form is changed in the longitudinal direction of the body.


Inventors:
ISHIDA SEIJI
TERAMOTO YOSHIHIKO
Application Number:
JP2010200797A
Publication Date:
March 22, 2012
Filing Date:
September 08, 2010
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
H01L21/52; H01L23/40
Domestic Patent References:
JPH11302917A1999-11-02
JPH07235560A1995-09-05
JPH0174595U1989-05-19
JP2010040337A2010-02-18
JP2005101489A2005-04-14
JP2008177232A2008-07-31