FIXING METHOD OF FLIP CHIP - Kyocera Kinseki Co., Ltd.

Title:

FIXING METHOD OF FLIP CHIP

Document Type and Number:

Japanese Patent JP3817594

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a fixing method of a flip chip wherein unnecessary hollow voids are not formed instead of filling underfill to a lower clearance of a flip chip.
SOLUTION: In this mounting method of a flip chip, a clearance between a flip chip, which is an IC chip with an oscillating circuit built in, and a board of a package is filled with a photoresist.

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Inventors:

Hirokazu Kobayashi

Application Number:

JP2002051160A

Publication Date:

September 06, 2006

Filing Date:

February 27, 2002

Export Citation:

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Assignee:

Kyocera Kinseki Co., Ltd.

International Classes:

H01L21/60; H01L21/56; (IPC1-7): H01L21/60; H01L21/56

Domestic Patent References:

JP11238758A
JP62122194A

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