To provide a fixing structure superior in mounting accuracy by fixing the circumference of a field emission cold-cathode element by inorganic adhesive having a prescribed hardening temperature.

A field emission cold-cathode element 2 is mounted on a conductive substrate 1 using a mount material 3. Secondly, the circumference of the field emission cold-cathode element 2 is fixed by the inorganic adhesive 4 which is hardened at the temperature lower than the hardening temperature of the mount material 3 used for the mount. The inorganic adhesive 4 which is hardened at the temperature lower than the hardening temperature of the mount material 3 used for mounting the field emission cold-cathode element 2 on the conductive substrate 1 is used for a position fixation so that the deterioration in the mounting accuracy can be prevented in fixing the position. A prescribed position accuracy can be held in a high temperature process in glass sealed in cathode-ray tube as an electronic gun.