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Title:
FLAME-RETARDANT RESIN COMPOSITION, FLAME-RETARDANT RESIN FILM AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2017088656
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a flame-retardant resin composition and a flame-retardant resin film which can achieve low warpage and excellent wafer protective performance after wafer molding.SOLUTION: The present invention provides a flame-retardant resin composition comprising the following (A), (B) and (C) components: (A) silicone resin having a constitutional unit of compositional formula (1) and with a weight average molecular weight of 3,000-500,000 [X is a divalent organic group represented by formula (2)], (B) triazine modified phenol novolac compound, and (C) filler.SELECTED DRAWING: None

Inventors:
KONDO KAZUNORI
ICHIOKA YOICHIRO
Application Number:
JP2015216560A
Publication Date:
May 25, 2017
Filing Date:
November 04, 2015
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08G59/30; C08G77/50; C08K3/36; C08L61/34; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
JP2015137327A2015-07-30
JP2003119345A2003-04-23
JP2003073641A2003-03-12
JP2014159555A2014-09-04
JP2001316454A2001-11-13
JP2004059689A2004-02-26
JP2000226439A2000-08-15
JP2001226464A2001-08-21
JPS61236833A1986-10-22
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Katsuhiko Masaki