Title:
FLAME-RETARDANT RESIN COMPOSITION AND METAL-CLAD LAMINATE FOR FLEXIBLE PRINTED-WIRING BOARD, COVER LAY, ADHESIVE SHEET FOR FLEXIBLE PRINTED-WIRING BOARD, AND FLEXIBLE PRINTED-WIRING BOARD USING THE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2013010955
Kind Code:
A
Abstract:
To provide a flame-retardant resin composition with excellent adhesion properties and excellent electrical characteristics of a printed-wiring board after being cured and molded as an adhesive for a printed-wiring board; and to provide a metal-clad laminate for a flexible printed-wiring board, a cover lay, an adhesive sheet for a flexible printed-wiring board, and a flexible printed-wiring board, using the resin composition.
The flame-retardant resin composition includes a thermosetting resin, a curing agent, and a phosphorous-containing polymer, wherein the thermosetting resin is preferably an epoxy resin.
Inventors:
DOBASHI HIDE
SOTOYAMA YUJI
KOIKE TSUNEO
TAI MAKOTO
SOTOYAMA YUJI
KOIKE TSUNEO
TAI MAKOTO
Application Number:
JP2012127561A
Publication Date:
January 17, 2013
Filing Date:
June 04, 2012
Export Citation:
Assignee:
ARISAWA SEISAKUSHO KK
International Classes:
C08L85/02; C08G59/50; C08G79/04; C08L63/00; C08L101/02; H05K1/03; H05K3/28
Attorney, Agent or Firm:
Taro Yaguchi
Junichiro Yanagi
Junichiro Yanagi