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Title:
FLAT CIRCUIT BODY ASSEMBLING STRUCTURE
Document Type and Number:
Japanese Patent JP2013009504
Kind Code:
A
Abstract:

To prevent looseness between a flat circuit body and a winding part, around which the flat circuit body is wound, and additionally improve waterproofness.

The flat circuit body assembling structure 1 comprises: a housing 2 having a base wall 21 with a through hole 22, a projection part 23 provided on a rear face of the base wall, a peripheral wall 24 provided on a top face of the base wall and fitted with a mating housing 8, a winding part 3 standing from an edge of the through hole and projecting in the peripheral wall, and a pair of slits 29 for FPC-insertion provided on the base wall on both sides of the winding part; an FPC 4 provided with a hole part 42 fitted with the projection part; and an elastic plug part 5 press-fitted with the through hole. While the hole part is fitted with the projection part and the FPC is bridged along the winding part and pulled to the rear side of the base wall, the plug part is press-fitted with the through hole, and therefore, the FPC is pressed to an inner face 22b of the through hole.


Inventors:
NAGASAWA MASANORI
Application Number:
JP2011140165A
Publication Date:
January 10, 2013
Filing Date:
June 24, 2011
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
H02G3/16
Domestic Patent References:
JPH11329625A1999-11-30
JPH0216587U1990-02-02
JP2000036340A2000-02-02
JPH04368791A1992-12-21
JPH0613084U1994-02-18
JPH11329625A1999-11-30
JPH0216587U1990-02-02
JP2000036340A2000-02-02
JPH04368791A1992-12-21
JPH0613084U1994-02-18
Foreign References:
EP1571735A22005-09-07
EP1571735A22005-09-07
Attorney, Agent or Firm:
Hideo Takino
Sadao Matsumura
Fumio Takino
Toshiaki Tsuda