平坦金属電気的処理 - Natur Incorporated

Title:

平坦金属電気的処理

Document Type and Number:

Japanese Patent JP2005520044

Kind Code:

A

Abstract:

The present invention relates to a process for forming a near-planar or planar layer of a conducting material, such as copper, on a surface of a workpiece using an ECMPR technique. The process preferably uses at least two separate plating solution chemistries to form a near-planar or planar copper layer on a semiconductor substrate that has features or cavities on its surface.

More Like This:

JPS601143	[Title of the Invention] A cutting device of hard material
JP3882992	WAFER POLISHING METHOD AND APPARATUS
WO/2003/060962	ELECTROLYTE COMPOSITION AND TREATMENT FOR ELECTROLYTIC CHEMICAL MECHANICAL POLISHING

Inventors:

Bazor, Brent M
Tarlier, Homayoung
Uzo, Cyprien Yee

Application Number:

JP2003514606A

Publication Date:

July 07, 2005

Filing Date:

July 22, 2002

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Natur Incorporated

International Classes:

B23H5/08; C25D5/02; C25D5/06; C25D5/10; C25D5/18; C25D5/22; C25D5/48; C25D7/12; H01L21/288; H01L21/3205; H01L21/321; H01L21/768; (IPC1-7): C25D5/22; C25D5/06; C25D5/10; C25D5/18; C25D5/48; C25D7/12; H01L21/288; H01L21/3205

Attorney, Agent or Firm:

Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto

Previous Patent: 電着における粒子の蓄積を避けるための方法および装置

Next Patent: 電解槽中の金属酸化物の還元