To provide a flexible circuit board with a molded article in which no disconnection occurs in circuit patterns at a portion of the circuit board protruded from the molded article.

The molded article (fixed section) 30 is formed to partially cover the circuit patterns 11 (11a and 11b) on the flexible circuit board 10 constituted by forming the circuit patterns 11 on the surface of a flexible insulating substrate 12. The molded article 30 is provided with substrate supporting sections 35 which are pulled out from the molded article 30 in the pulling-out directions of the circuit patterns 11 to support the lower surface of the circuit board 10. Consequently, when the circuit board 10 is bent toward the supported side by the substrate supporting sections 35, the radius of curvature of the bent circuit board 10 becomes larger and the possibility of occurring mechanical disconnection in the circuit patterns 11 is eliminated.