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Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2007165417
Kind Code:
A
Abstract:

To provide a flexible printed wiring board capable of reducing a manufacturing cost while keeping bendability and saving troubles in a manufacturing process.

The flexible printed wiring board is manufactured by forming a conductor pattern 2 on a flexible base 1 and bending for use. The conductor pattern 2 and a resist 4 of an ink type are formed inside a bent part 3.


Inventors:
KOYAMA MASAYA
NAGAOKA HIDENORI
Application Number:
JP2005356996A
Publication Date:
June 28, 2007
Filing Date:
December 09, 2005
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H05K1/02; H05K3/28
Domestic Patent References:
JP2005310905A2005-11-04
JP2004063691A2004-02-26
JPH0792480A1995-04-07
JPH038467U1991-01-28
JP2002293882A2002-10-09
JP2002298667A2002-10-11
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori



 
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