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Title:
THERMISTOR DEVICE, AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2007165418
Kind Code:
A
Abstract:

To provide a thermistor device capable of rigidly and surely coupling a lead conductor with a terminal board without influencing thermistor characteristics, and to provide its manufacturing method.

The thermistor device includes a thermistor element 10 and the terminal board. The thermistor element 10 has lead conductors, and ends of the lead conductors 14 and 15 are fusion-bonded to the terminal board 20 out of a board surface 21 of the board 20. The manufacturing method of the thermistor device includes steps of aligning in position the ends of the lead conductors 14 and 15 with a part protruding from the board surface 21 of the board 20, and then fusion-bonding the terminal board 20 to the lead conductors 14 and 15.


Inventors:
SATO KAZUO
Application Number:
JP2005357023A
Publication Date:
June 28, 2007
Filing Date:
December 09, 2005
Export Citation:
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Assignee:
TDK CORP
International Classes:
H01C7/04; G01K7/22
Domestic Patent References:
JP2004179551A2004-06-24
JPS6015783U1985-02-02
JP2601046B21997-04-16
JPH10239168A1998-09-11
JP2001116713A2001-04-27
JPH0590309A1993-04-09
JP2005072022A2005-03-17
Attorney, Agent or Firm:
Mijiro Abe
Yoshikazu Takei