FLEXIBLE PRINTED WIRING BOARD

Japanese Patent JP2017011191

A

PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which can interrupt overcurrent relatively quickly.SOLUTION: A flexible printed wiring board according to one embodiment of the present invention includes a base film having insulating properties, a conductive pattern laminated on at least one side of the base film, and a coverlay covering the conductive pattern. In one or a plurality of regions overlapping with a part of the conductive pattern in plan view, one or a plurality of coverlay non-existence regions in which the coverlay does not exist are provided, in the one or more coverlay non-existent regions, a cover material having a thermal conductivity lower than that of the coverlay and having a matrix as a main component thereof is provided. The conductive pattern constitutes a part of a circuit and has one or a plurality of fuse portions whose sectional area is smaller than that of the other portion. The coverlay non-existence region may overlap with the fuse part in plan view.SELECTED DRAWING: Figure 1

SAITO HIROHISA
UCHIDA YOSHIFUMI
TSUMAGARI TAKAYUKI
TAKASE SHINICHI

JP2015127096A

January 12, 2017

June 24, 2015

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SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO ELECTRIC PRINTED CIRCUIT INC
AUTO NETWORK GIJUTSU KENKYUSHO KK
SUMITOMO WIRING SYSTEMS

H05K1/16; H01H85/046; H05K3/28

JP2010050225A	2010-03-04
JP2005078867A	2005-03-24
JP2013100406A	2013-05-23
JP2008060270A	2008-03-13
JPS55108776U	1980-07-30

WO2001069988A1

2001-09-20

Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka

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