Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2021197408
Kind Code:
A
Abstract:
To provide a flexible printed wiring board having excellent ability to generate electromagnetic induction.SOLUTION: A flexible printed wiring board according to an embodiment of the present disclosure includes a plurality of insulation layers, and three or more planar coil layers arranged alternately with these plurality of insulating layers, and a first planar coil layer located from the outermost surface from among the three or more planar coil layers and the entire plurality of second and subsequent planar coil layers located from the outermost surface from among the three or more planar coil layers are connected in series, the plurality of second planar coil layers are connected in parallel to each other, and the resistance of the planar coil layer of the k-1th layer (k is an integer of 2 or more) and the resistance of the planar coil layer of the kth layer satisfy a predetermined formula, and the resistance of the first planar coil layer is equal to or greater than the combined resistance of the plurality of second planar coil layers, and the number of turns of the first planar coil layer is equal to or greater than the number of turns of the plurality of second planar coil layers.SELECTED DRAWING: Figure 2
Inventors:
TOKUYAMA SHINJI
YAMASHITA MASANAO
YAMASHITA MASANAO
Application Number:
JP2020101230A
Publication Date:
December 27, 2021
Filing Date:
June 10, 2020
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01F17/00; H01F17/04; H05K1/03; H05K1/16
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Koji Ishida
Yoshinori Ikeda
Koji Ishida