Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2021197409
Kind Code:
A
Abstract:
To provide a flexible printed wiring board with excellent ability to generate electromagnetic induction.SOLUTION: A flexible printed wiring board 10 includes a plurality of insulating layers 31, 32, 33, and 34, and three or more planar coil layers arranged alternately with the plurality of insulating layers. The three or more planar coil layers includes one or more first planar coil layers L1 located from the outermost surface to the kth layer (k is an integer of 1 or more), and a plurality of second planar coil layers L2, L3, L4, and L5 located after the first k+1 layer. The number of layers of the plurality of second planar coil layers is larger than the number of layers of one or more first planar coil layers, and the whole of one or more first planar coil layers and the whole of the plurality of second planar coil layers are connected in parallel, the plurality of first planar coil layers are connected in series with each other, and the plurality of second planar coil layers are connected in series with each other.SELECTED DRAWING: Figure 2
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Inventors:
TOKUYAMA SHINJI
YAMASHITA MASANAO
YAMASHITA MASANAO
Application Number:
JP2020101234A
Publication Date:
December 27, 2021
Filing Date:
June 10, 2020
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01F38/14; H01F5/00; H01F17/00; H01F27/28; H05K1/03; H05K1/16
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Koji Ishida
Yoshinori Ikeda
Koji Ishida