Title:
フレキシブル熱電モジュール
Document Type and Number:
Japanese Patent JP6975730
Kind Code:
B2
Abstract:
At least some aspects of the present disclosure direct to a flexible thermoelectric module. The thermoelectric module includes a flexible substrate, a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements, a first set of connectors, and a second set of connectors. The substrate includes a plurality of vias filled with an electrically conductive material or thermoelectric elements. In some cases, the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements are disposed on the flexible substrate.
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Inventors:
Rezyon
Roger W. Burton
Donato G. Carreague
Ankit Mahajan
Ravi Paraniswamy
James F. Pock
Michael W. Dresal
Roger W. Burton
Donato G. Carreague
Ankit Mahajan
Ravi Paraniswamy
James F. Pock
Michael W. Dresal
Application Number:
JP2018567124A
Publication Date:
December 01, 2021
Filing Date:
June 22, 2017
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
H01L35/32; H01L35/34; H02N11/00
Domestic Patent References:
| JP201191243A | ||||
| JP200640963A |
Foreign References:
| KR1020150116187A |
Attorney, Agent or Firm:
Taro Akazawa
Wakako Nomura
Tsukuda Seigen
Keiichi Asamura
Wakako Nomura
Tsukuda Seigen
Keiichi Asamura