Title:
FLEXIBLE WIRING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3514646
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a flexible wiring board and manufacture thereof using a thermoplastic insulation layer and having a conductor foil, such as Cu foil, surely thermally welding to a filmy insulation layer into one body and a solder heat resistance.
SOLUTION: A molding material, i.e., a thermoplastic resin compsn. composed of a polyarylketone resin having a crystal melting peak temp. of 260°C or higher 65-35 wt.%, and an amorphous polyetherimide resin 35-65 wt.% is formed into a filmy insulator so as to satisfy the relation (ΔHm-ΔHc)/ΔHmm≤0.5 between the glass transition temp. of 150-230°C measured by the differential scan calorimetry at the temp. rise, the crystal melting heat quantity ΔHm and the crystallizing heat quantity ΔHc generated by the crystallization during temp. rise, and the conductor foil is thermally welded to one or each side of the filmy insulator in the heating and pressing conditions, so as to satisfy the relation (ΔHm-ΔHc)/ΔHmm≥0.7 and then is etched to form a conductive circuit.
Inventors:
Yamada, Shingetsu
Takagi, Jun
Taniguchi, Koichiro
Kuwamura, Shingo
Nomoto, Kaoru
Takagi, Jun
Taniguchi, Koichiro
Kuwamura, Shingo
Nomoto, Kaoru
Application Number:
JP53899A
Publication Date:
March 31, 2004
Filing Date:
January 05, 1999
Export Citation:
Assignee:
MITSUBISHI PLASTICS IND LTD
DENSO CORP
DENSO CORP
International Classes:
H05K1/03; B29C65/44; B32B15/08; C08L71/10; C08L73/00; C08L79/08; H05K3/00; H05K3/38; B29K73/00; B29K79/00; B29L9/00; B29L31/34; (IPC1-7): H05K1/03; B29C65/44; B32B15/08; C08L71/10; C08L73/00; C08L79/08; H05K3/00; H05K3/38
Attorney, Agent or Firm:
鎌田 文二 （外２名）
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