MULTILAYER PRINTED WIRING SUBSTRATE AND ITS MANUFACTURE

Japanese Patent JP3514647

B2

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring substrate which is integrally laminated by a heat seal of film-like insulator and is high in reliability in insulation, even if a circuit pattern with high density is formed.
SOLUTION: A film-like insulator is formed with a thermoplastic resin composition made of a polyarylketone resin of 35 to 65 wt.%, such as polyether etherketone of crystal fusion peak temperatures 260°C or above or the like and an amorphous polyetherimide resin 35 to 65 wt.%, its glass transfer temperature are 150 to 230°C, a relation between a crystal fusion heat value ΔHm and a crystallized heat value ΔHc is represented by equation (I), a both-face through hole is formed, the interior of the through hole is filled up with conductive paste to form an interlayer connecting heat sealing property film of a laminated electrical circuit, and conductor foils are overlaid on one face or both faces, with the result that the thermoplastic resin composition is heat-sealed as shown by equation (II). Thereafter, a circuit is formed in the conductor foils to provide a film-like wiring substrate, a plurality of lamination materials made of the interlayer connecting heat sealing property film are alternately overlaid, and the thermoplastic resin composition constituting each layer is heat-sealed as shown in equation (III) to manufacture a multilayer printed wiring substrate.

Yamada, Shingetsu
Takagi, Jun
Taniguchi, Koichiro
Nomoto, Kaoru
Echigo, Susumu

JP57799A

March 31, 2004

January 05, 1999

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MITSUBISHI PLASTICS IND LTD
DENSO CORP

H05K3/46; C08L71/00; C08L71/10; C08L71/12; C08L73/00; C08L79/08; (IPC1-7): H05K3/46; C08L71/00; C08L71/10; C08L71/12; C08L73/00; C08L79/08

鎌田 文二 （外２名）

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