Title:
フレキシブル配線回路基板、その製造方法および撮像装置
Document Type and Number:
Japanese Patent JP6990987
Kind Code:
B2
Abstract:
A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 μm or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10−6/% RH or less.
Inventors:
Shusaku Shibata
Hayato Takakura
Yoshihiro Kawabe
Shuichi Wakaki
Hayato Takakura
Yoshihiro Kawabe
Shuichi Wakaki
Application Number:
JP2017090243A
Publication Date:
January 12, 2022
Filing Date:
April 28, 2017
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H05K1/03; C08G73/10; H05K1/02
Domestic Patent References:
| JP2013100441A | ||||
| JP2009184131A | ||||
| JP62242384A | ||||
| JP2000133896A | ||||
| JP2007046054A | ||||
| JP2014172978A | ||||
| JP2014166722A | ||||
| JP2010031258A |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda