Title:
FLIP CHIP TYPE LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2002118294
Kind Code:
A
Abstract:
To provide a reliable flip chip type light-emitting diode together with its manufacturing method by reducing alignment failure in a die-bonding process, related to the light-emitting diode which is used as various light-emitting elements such as an indicator, display, and printer head of an optical printer as well as a light-receiving element such as a solar cell.
The flip chip type light-emitting diode is provided where a package comprising a package electrode and an LED chip in which an n-type electrode and a p-type electrode are provided on the same surface are fitted with a solder. Here, an oxide film is provided on the surface except for a solder joint part.
More Like This:
Inventors:
TAMEMOTO HIROAKI
Application Number:
JP2001106049A
Publication Date:
April 19, 2002
Filing Date:
April 04, 2001
Export Citation:
Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01L21/52; H01L33/62; (IPC1-7): H01L33/00; H01L21/52
Domestic Patent References:
JPH09283803A | 1997-10-31 | |||
JPH0222605A | 1990-01-25 | |||
JPH1154563A | 1999-02-26 | |||
JPS5413774A | 1979-02-01 | |||
JPH07321412A | 1995-12-08 | |||
JPS63130258A | 1988-06-02 | |||
JPS548462A | 1979-01-22 | |||
JPS5421261A | 1979-02-17 | |||
JPH07142491A | 1995-06-02 | |||
JPH1177377A | 1999-03-23 | |||
JPH07326856A | 1995-12-12 | |||
JPH0992682A | 1997-04-04 |