Title:
FLIP CHIP TYPE LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2002118294
Kind Code:
A
Abstract:
To provide a reliable flip chip type light-emitting diode together with its manufacturing method by reducing alignment failure in a die-bonding process, related to the light-emitting diode which is used as various light-emitting elements such as an indicator, display, and printer head of an optical printer as well as a light-receiving element such as a solar cell.
The flip chip type light-emitting diode is provided where a package comprising a package electrode and an LED chip in which an n-type electrode and a p-type electrode are provided on the same surface are fitted with a solder. Here, an oxide film is provided on the surface except for a solder joint part.
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Inventors:
TAMEMOTO HIROAKI
Application Number:
JP2001106049A
Publication Date:
April 19, 2002
Filing Date:
April 04, 2001
Export Citation:
Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01L21/52; H01L33/62; (IPC1-7): H01L33/00; H01L21/52
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