Title:
FLOOR HEATING PANEL
Document Type and Number:
Japanese Patent JP2008151463
Kind Code:
A
Abstract:
To prevent a nail for fixing a panel material of a floor heating panel to a backing plate, from being erroneously driven into a thin-walled part of the panel material.
The floor heating panel for laying tubes for a heat medium to pass through is formed with laying grooves 3 for laying the tubes 2, on one face 16 of the panel material 15, and provided with indicating parts 18 in positions corresponding to the bottom parts of the grooves 3 on the other face 17, to indicate that the positions are groove bottom parts. The indicating parts 18 are formed of recesses formed on the other face 17.
Inventors:
TSUCHIYA SADAMITSU
TANAKA SHINPEI
OISHI KOICHI
HIRABAYASHI HIDEO
TANAKA SHINPEI
OISHI KOICHI
HIRABAYASHI HIDEO
Application Number:
JP2006341991A
Publication Date:
July 03, 2008
Filing Date:
December 20, 2006
Export Citation:
Assignee:
SHINWA TEKKU KK
SHINWA SANGYO KK
SHINWA SANGYO KK
International Classes:
F24D3/16; E04F15/18
Domestic Patent References:
| JP2005069501A | 2005-03-17 | |||
| JPH11264556A | 1999-09-28 | |||
| JP2006038367A | 2006-02-09 |
Attorney, Agent or Firm:
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada
Toshiji Sasahara
Yohei Harada