Title:
FLOOR POLISH COMPOSITION
Document Type and Number:
Japanese Patent JP3328977
Kind Code:
B2
Abstract:
PURPOSE: To provide an emulsified high-solid floor polish composition excellent in properties such as application workability, heel mark resistance and scratch resistance.
CONSTITUTION: The floor polish composition contains an emulsion prepared by emulsion-polymerizing at least one vinyl monomer and adding 3-20wt.%, based on the vinyl monomer, solvent having a solubility of 5% or below in water at 20°C and a molecular weight of 100-300 during the emulsion polymerization. In a desirable embodiment, this composition comprises 67-85 pts.wt. (in terms of the solid matter) this emulsion, 5-50 pts.wt. wax, and 3-10 pts.wt. alkali- soluble resin and has a solid content of 30-35wt.%.
Inventors:
Kenji Miyata
Teruo Kikuta
Teruo Kikuta
Application Number:
JP748293A
Publication Date:
September 30, 2002
Filing Date:
January 20, 1993
Export Citation:
Assignee:
Nippon Shokubai Co., Ltd.
International Classes:
C09G1/00; C09G1/04; E04F15/12; (IPC1-7): C09G1/04
Other References:
【文献】国際公開94/14907(WO,A1)
【文献】国際公開94/14909(WO,A1)
【文献】国際公開94/14909(WO,A1)
Attorney, Agent or Firm:
Kyuichi Ueki