To solve a problem wherein, for a liquid flux reduced in the amount of a VOC or not using the same, the conventional actual soldering achievement can not be applied to it, because it uses water difficult to evaporate relative to alcohol, and the water content cannot be perfectly removed before input to a jet-flow solder tank, under the pre-heating temperature of the conventional flux.
This flow soldering method is performed as follows. A land 12b of a through-hole of a board 8 and a land 12a of a component mounting surface 10 are irradiated with plasma 1; a metal mask 14 is installed on a soldering surface 11 of the through-hole 9; solder paste 15 is applied through the metal mask 14 by a solder dispenser 16; thereafter an insertion component 17 is mounted from the component mounting surface 10 being a surface opposite to the soldering surface 11 of the board 8; and the board 8 is soldered in a jet-flow solder tank 20.
| JPH02227644 | METHOD FOR INSPECTING SOLDERING OF PRINTED BOARD |
| JPS6478000 | SHIELD-CASE ATTACHING DEVICE |
NAKATANI MASAAKI
KISHI ARATA
Daisuke Nagano
Kentaro Fujii
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