FLUIDIZED DIP LINING APPARATUS AND FLUIDIZED DIP LINING METHOD

Japanese Patent JP2005074304

A

To provide a fluidized dip lining apparatus and a fluidized dip lining method by which a desired film thickness is secured without repeating the preheating of an objective material to be lined with a resin and the performance deterioration of a lining material is suppressed to the minimum and the yield of lining powder is improved.

The fluidized dip lining apparatus 100 is provided with a high frequency induction heating furnace 101 for housing the objective material 50 to be lined and heating with high frequency, a powder supply means provided with an injection port 23 for supplying the resin powder into the furnace and a powder fluidizing means composed of a porous ceramic member and including a floor plate having fine holes for supplying fluidizing fluid into the furnace. The objective material to be lined is preheated in the high frequency induction heating furnace and after being preheated, lined by dipping in the resin powder without being discharged to the outside of the furnace.

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OKANO MASATOSHI
YOSHITOMI SHOZO

JP2003307268A

March 24, 2005

August 29, 2003

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OKANO VALVE MFG CO

H05B6/22; B05C9/14; B05C19/02; B05C19/06; B05D3/02; B05D7/24; (IPC1-7): B05C19/02; B05C9/14; B05C19/06; B05D3/02; B05D7/24; H05B6/22

Michiteru Soga
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Yoshikazu Takei

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