To provide a foam molding apparatus having die cooling pipes easy to lay in a die mounting frame while avoiding the arranged parts of die supports or the like and uniformly cooling the whole die without adopting exclusive cooling pipes corresponding to the shape of the die when replacing the die.

A main pipe 7 is disposed along the lower face of an upper side frame part of the die mounting frame 1A, and a plurality of flexible branch pipes 8 provided with cooling water jet holes 9 at every small space in the length direction are suspended from the main pipe 7 at every fixed space in a state of the upper end openings communicating with the main pipe 7. When jetting cooling water from the cooling water jet holes 9 to cool the die, the flexible branch pipes 8 are lateral vibrated by the reaction or the like of the jet pressure to uniformly jet the cooling water to the whole die surface, and when replacing the die, the branch pipes 8 are curved to make a detour around the die posts 6 so that the tip faces of the posts 6 are received by the inner surface of a back plate 4.