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Title:
FORMATION OF COATING LAYER BY BUILD-UP WELDING ON COPPER PLATE
Document Type and Number:
Japanese Patent JPS60152384
Kind Code:
A
Abstract:

PURPOSE: To eliminate the need for preheating of a copper plate prior to welding by cladding a stainless steel, etc. by build-up welding on the copper plate while melting the same by laser welding thereby forming the boundary part of joining to a narrow wedge shape, and joinning metallurgically strongly.

CONSTITUTION: A filler wire consisting of a stainless steel material (ferritic, austenitic of Ni- and/or Cr-contg. steel material) is built up by laser welding onto the surface of a copper plate 1 in an ordinary temp. without preheating the same to a high temp. A coating layer 2 consisting of the stainless steel is thus formed. The reinforcement of weld of the above-described laser weld zones 2a are superposed on each other so that the joint part between the parts 2a and the plate 1 is made into a wedge shape.


Inventors:
SASAKI HIROAKI
NISHIYAMA NOBORU
Application Number:
JP674084A
Publication Date:
August 10, 1985
Filing Date:
January 17, 1984
Export Citation:
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Assignee:
KAWASAKI STEEL CO
International Classes:
B23K26/34; B23K9/04; (IPC1-7): B23K9/04; B23K26/00
Attorney, Agent or Firm:
Yoshikatsu Matsushita



 
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