Title:
FORMATION OF METAL WIRING
Document Type and Number:
Japanese Patent JP2954369
Kind Code:
B2
Abstract:
PURPOSE: To improve productivity and at the same time reduce occurrence rate of failure due to corrosion and than improve yield.
CONSTITUTION: A resist pattern 6 is formed on a multilayer metal film 5 in a first process and then an A alloy film 4 is etched in a second process using chlorine gas atmosphere. At this time, although a chlorine deposit 7 stays, the chlorine deposit 7 is eliminated almost completely when the resist pattern 6 is etched in a third process using oxygen gas atmosphere. A TiW film 3 is etched using fluorine gas atmosphere in a fourth process. At this time, a fluorine deposit 8 stays as a protection film. After that, it is taken into atmosphere in a fifth process and then washed by pure water, etc., to obtain metal wiring.
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Inventors:
YAMAMOTO HIROSHI
MASUDA YOJI
MASUDA YOJI
Application Number:
JP2193691A
Publication Date:
September 27, 1999
Filing Date:
February 15, 1991
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
H01L21/28; H01L21/302; H01L21/3065; H01L21/3205; H01L21/3213; H01L23/52; (IPC1-7): H01L21/3213; H01L21/3065
Attorney, Agent or Firm:
Miyai Akio