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Patent Searching and Data


Title:
FORMING DEVICE FOR COMPOUND THIN-FILM
Document Type and Number:
Japanese Patent JPS6329925
Kind Code:
A
Abstract:

PURPOSE: To equalize the distribution of reactive-gas ions on a substrate, and to obtain a homogeneous compound thin-film extending over a wide area by mounting a meshy electrode to either one or both of an ionizing electron leading-out electrode for a reactive gas or an accelerating electrode.

CONSTITUTION: A meshy electrode 22 is fitted into the surface approximately vertical to the progressive direction of a reactive gas to an electron leading-out electrode 19 for ionizing the reactive gas and an accelerating electrode 21 for the reactive gas. When the reactive gas 20 is injected toward a substrate 16 from a nozzle 5 for the reactive gas, the reactive gas 20 is ionized, and is further accelerated and collides with the substrate 16. The distribution of reactive- gas ions is equalized on the substrate 16 by the action of the meshy electrode 22 set up to the electron leading-out electrode 19 for ionizing the reactive gas and the accelerating electrode 21 for the reactive gas at that time, a reaction with the clusters 14 of a deposited substance progresses in the vicinity of the substrate 16, and a homogeneous high-quality compound thin-film is shaped extending over a wide area.


Inventors:
YAMANISHI KENICHIRO
KAWAGOE YASUYUKI
ETSUCHU MASAO
Application Number:
JP17271786A
Publication Date:
February 08, 1988
Filing Date:
July 24, 1986
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/203; H01L21/027; H01L21/26; H01L21/30; (IPC1-7): H01L21/203; H01L21/26
Attorney, Agent or Firm:
Soga Doteru