To provide a forming method of a resist pattern wherein a sectional form is an overhang type, resistance to heat is high, and easy elimination by organic solvent is enabled after thermal load is applied, and to provide a wiring forming method using the forming method of a resist pattern, and an electronic component provided with a metal wiring formed by using the wiring forming method.

On a substrate 1, a first resist layer 11 is formed which can be dissolved by developer for a second resist layer 12 and has resistance to heat and strippability. On the first resist layer 11, a second resist layer 12 is formed which is composed of photoresist having resistance to heat. After exposure, the second resist layer 12 on the upper layer side is developed by using developer, and the first resist layer 11 on the lower layer side is etched, thereby forming an overhang type pattern.