Title:
Free-flowing pressure sensitive adhesive
Document Type and Number:
Japanese Patent JP6025723
Kind Code:
B2
Abstract:
Hot melt adhesive consisting of a pressure sensitive adhesive comprising at least one polymer selected from polyester, polyacrylate, polyolefin, polyurethane, ethylene vinyl acetate polymers, styrene blockcopolymers or mixtures, at least one tackifier and additives the adhesives having the form of pellets, each pellet of adhesive has an outer shell of a film forming material, whereby i)the adhesive has a softening point of 80 to 150 °C and has at 25°C a tacky surface, ii) the film forming material is a thermoplastic polymer with a melting point of less than 120 °C, iii) each pellet being completely surrounded by the film material, so that the pellets have a non-blocking surface and are free flowing at a temperature of less then 45°C. Such pellets can be used as feed for automated feeder devices for the supply hot melt application systems.
Inventors:
David Duckworth
Geralt Petri
Gunter Kratz
Eckhart Purkner
Milan Burgsmuller
Geralt Petri
Gunter Kratz
Eckhart Purkner
Milan Burgsmuller
Application Number:
JP2013522190A
Publication Date:
November 16, 2016
Filing Date:
July 21, 2011
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
C09J167/00; B29C48/21; C09J11/06; C09J123/00; C09J123/06; C09J123/12; C09J131/04; C09J133/00; C09J153/02; C09J175/04
Domestic Patent References:
| JP2002338933A | ||||
| JP2005199706A | ||||
| JP2004314516A | ||||
| JP2000502120A |
Foreign References:
| US6716527 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Hiroshi Yamazaki
Kenichi Morizumi
Kajita Marina
Hiroshi Yamazaki
Kenichi Morizumi
Kajita Marina