Title:
A plasma treatment apparatus for adjusting electric deviation, a liner assembly, a plasma processing method
Document Type and Number:
Japanese Patent JP6025722
Kind Code:
B2
Abstract:
The invention discloses a plasma processing apparatus comprising a chamber lid, a chamber body and a support assembly. The chamber body, defining a processing volume for containing a plasma, for supporting the chamber lid. The chamber body is comprised of a chamber sidewall, a bottom wall and a liner assembly. The chamber sidewall and the bottom wall define a processing volume for containing a plasma. The liner assembly, disposed inside the processing volume, comprises of three or more slots formed thereon for providing an axial symmetric RF current path. The support assembly supports a substrate for processing within the chamber body. With the liner assembly with several symmetric slots, the present invention can prevent electromagnetic fields thereof from being azimuthal asymmetry.
Inventors:
Carducci James Dee
Change gang
Rauf Shahid
Collins Kenneth S
Change gang
Rauf Shahid
Collins Kenneth S
Application Number:
JP2013520730A
Publication Date:
November 16, 2016
Filing Date:
July 06, 2011
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H05H1/46; C23C16/44; H01L21/3065
Domestic Patent References:
| JP2004079557A | ||||
| JP2004363316A | ||||
| JP2006111906A | ||||
| JP2003223999A | ||||
| JP2009140939A | ||||
| JP2008300410A |
Foreign References:
| US20090028761 | ||||
| WO2007029777A1 | ||||
| WO2000013203A1 |
Attorney, Agent or Firm:
Yoshiaki Anzai
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