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Title:
FRP BOARD HEATING PLATE
Document Type and Number:
Japanese Patent JPH05182749
Kind Code:
A
Abstract:

PURPOSE: To obtain a large FRP board heating plate generating no warping by providing an insulating layer on the surface of a conductive layer avoiding an electrode and a connection of the electrode to the outer side.

CONSTITUTION: An FRP board plate 1 is provided with a conductive layer 2. On the surface of the conductive layer 2, an insulating layer 4 is provided avoiding an electrode 3 and its connection to the outer side. The FRP is so- called fiber reinforced plastics, and a heat resisting fiber such as a glass fiber, a carbon fiber, and a polyimide is used as its fiber. A heat resisting resin such as a thermosetting resin and the polyimide is used as its resin component.


Inventors:
SHIOZAWA MASATATSU
SATO MASAO
Application Number:
JP35757591A
Publication Date:
July 23, 1993
Filing Date:
December 26, 1991
Export Citation:
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Assignee:
SHOWA SHELL SEKIYU
International Classes:
A01K1/02; E04C2/52; F24D13/02; H05B3/20; (IPC1-7): A01K1/02; E04C2/52; F24D13/02; H05B3/20
Attorney, Agent or Firm:
Eiji Tomomatsu (1 person outside)



 
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