Title:
ガスバリア性樹脂組成物、塗料および接着剤
Document Type and Number:
Japanese Patent JP4189634
Kind Code:
B2
More Like This:
| JP2001323045 | THERMOSETTING RESIN COMPOSITION |
| JP2004168922 | DIE ATTACH PASTE AND SEMICONDUCTOR DEVICE |
Inventors:
Takaaki Kutsuna
Shuta Kihara
Takeshi Koyama
Shuta Kihara
Takeshi Koyama
Application Number:
JP2002185150A
Publication Date:
December 03, 2008
Filing Date:
June 25, 2002
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08G59/46; C09D163/00; C09D163/02; C09D177/06; C09J5/02; C09J163/00; C09J163/02; C09J177/06
Domestic Patent References:
| JP5140555A | ||||
| JP6329952A |
Attorney, Agent or Firm:
Takashi Nagai