PURPOSE: To obtain glass fiber fabric excellent in impregnatability with a resin varnish when producing a printed circuit board by the continuous molding method and capable of producing a printed circuit board excellent in heat shock resistance.

CONSTITUTION: Glass fiber fabric in which the weave type is sateen weave or twill weave. Since the fabric is excellent in impregnatability, occurrence of insufficient impregnation is very rare even when used for production of a printed circuit board by the continuous molding method. In addition, the number of intersection between the weft and the warp is lower than that in a plain weave and measling, therefor, is rarely caused by heat shock in a printed circuit board using this invented glass fiber fabric.