Title:
GLASS AND SHEATH TUBE FOR SEMICONDUCTOR SEALING
Document Type and Number:
Japanese Patent JP2014141397
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a glass for semiconductor sealing which satisfies conditions necessary for a glass for semiconductor sealing, specifically, a sealing temperature of 650°C or lower and a coefficient of linear expansion in a temperature range of 30 to 380°C of 85 to 100×10/°C, and is excellent in acid resistance, regardless of a glass having a low content of a lead, and to provide a sheath tube for semiconductor sealing.SOLUTION: A glass for semiconductor sealing contains, as a glass composition, by mass%, 5 to 35% of PbO, 40 to 55% of SiO, and 5 to 20% of LiO+NaO+KO; and preferably contains 5 to 35% of PbO, 40 to 55% of SiO, 0 to 5% of AlO, 0 to 15% of BO, 0 to 5% of MgO, 0 to 5% of CaO, 0 to 5% of BaO, 0 to 5% of SrO, 0 to 10% of ZnO, 1 to 5% of LiO, 0 to 10% of NaO, 0 to 10% of KO, 5 to 20% of LiO+NaO+KO, 0 to 10% of TiO, and 0 to 3% of ZrO.
Inventors:
YABUUCHI KOICHI
Application Number:
JP2013261145A
Publication Date:
August 07, 2014
Filing Date:
December 18, 2013
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO
International Classes:
C03C3/102; C03C3/105; C03C3/108; H01L23/08
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