Title:
研削盤
Document Type and Number:
Japanese Patent JP4165302
Kind Code:
B2
Inventors:
Kao Wakazono
Hisashi Kobayashi
Hisashi Kobayashi
Application Number:
JP2003158008A
Publication Date:
October 15, 2008
Filing Date:
June 03, 2003
Export Citation:
Assignee:
JTEKT Corporation
International Classes:
B24B5/04; B24B41/06
Domestic Patent References:
| JP2003136399A | ||||
| JP60242968A | ||||
| JP2001082469A | ||||
| JP64041724U | ||||
| JP62218001A |
Attorney, Agent or Firm:
Kobayashi Osamu