Title:
GRINDING APPARATUS
Document Type and Number:
Japanese Patent JP2023053560
Kind Code:
A
Abstract:
To grind a workpiece held by a chuck table while measuring the height of an upper surface of the workpiece even if the thickness of the workpiece before grinding exceeds a measuring range of an upper surface measuring instrument.SOLUTION: A grinding apparatus acquires a ground-off quantity of a wafer 5 by subtracting a wear amount |(H0-H1)| of a grind stone 77, which is acquired by means of an upper surface height measuring instrument 80 that is lifted and lowered along with a grinding mechanism 70, from a lowering amount |(Z0-Z1)| of the grinding mechanism 70, which is acquired by means of a Z-axis encoder 65. Since the ground-off quantity of the wafer 5 is measured using the upper surface height measuring instrument 80 and the Z-axis encoder 65, it is not necessary to obtain the ground-off quantity of the wafer 5 only by an upper surface height measuring instrument provided on a base 3 as in the conventional art. Therefore, even if the thickness of the wafer 5 before grinding or the ground-off quantity of the wafer 5 exceeds the measurement range of the upper surface height measuring instrument 80, the wafer 5 can be ground while measuring the ground-off quantity of the wafer 5 held by a chuck table 20.SELECTED DRAWING: Figure 4
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Inventors:
MORI TAKENOBU
HANEDA MAI
HANEDA MAI
Application Number:
JP2021162666A
Publication Date:
April 13, 2023
Filing Date:
October 01, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B49/04; B24B7/04; B24B47/22; B24B49/12
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office
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