GRINDING DEVICE

Japanese Patent JP2011131284

A

To provide a grinding device capable of grinding and polishing a large plate-like material in a reduced space.

Each of holding mechanisms 2a, 2b for holding workpieces has a first holding surface 21 holding a workpiece on one surface along the vertical direction, and a second holding surface 22 holding a workpiece on the other surface along the vertical direction. A grinding mechanism 3 includes a first grinding part 3a facing the first holding surface 21 and a second grinding part 3b facing the second holding surface 22. The workpieces are ground while rotating in a state where the workpiece held on the first holding surface 21 and the workpiece held on the second holding surface 22 are pressed against the first grinding part 3a and the second grinding part 3b, respectively, causing the workpieces to be sandwiched. Since the holding surfaces 21, 22 are made vertical, the device is prevented from being upsized accompanied by the workpiece, even if the workpiece is upsized, which suppresses the upsizing of the device.

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SUZUKI KUNISHIGE

JP2009290378A

July 07, 2011

December 22, 2009

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DISCO ABRASIVE SYSTEMS LTD

B24B7/17; B24B7/22; B24B41/06; H01L21/304; H01L21/683

JP2005014122A	2005-01-20
JP2004351594A	2004-12-16
JPH08504368A	1996-05-14
JP2006332281A	2006-12-07
JP2004025346A	2004-01-29
JPH11309665A	1999-11-09

Isao Sasaki
Kyoko Kawamura
Ken Kubo

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