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Title:
GRINDING TOOL
Document Type and Number:
Japanese Patent JPH06238565
Kind Code:
A
Abstract:

PURPOSE: To improve the chip discharge efficiency by forming forward surface of abrasive particles with specified intervals in the circumferential direction in a working range of a tool to identify the circumferential width of the forward surface in a total shape grinding tool having abrasive particles electrically coupled with a base body.

CONSTITUTION: A total shape grinding tool is provided with a base body 1 having its working range 2 formed in a contour to be ground on its outer circumference, and abrasive particles formed of highly rigid material such as diamond and CBN are electrically coupled (electro-deposition) in the form of a forward surface 3 of the abrasive particles. The forward surface 3 of the abrasive particles comprise one or a plurality of rows of particles, and the interval (x) of the forward surface 3 of the successive abrasive particles in the circumferential direction is set in a range of 1.0-6.0 mm, while the circumferential width (b) of the forward surface 3 of the successive abrasive particles 3 is set to be smaller than four times the diameter of the particles. A chip space is sufficiently ensured, a hydroplane effect in using a cutting oil is avoided, and the chip discharge efficiency is increased.


Inventors:
BUERUNERU PITSUKERUTO
KURAUSU RETSUSHIYU
Application Number:
JP26776392A
Publication Date:
August 30, 1994
Filing Date:
August 26, 1992
Export Citation:
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Assignee:
KAPP & CO
International Classes:
B23F21/02; B24D5/00; B24D5/06; B24D3/00; B24D18/00; (IPC1-7): B24D5/00; B24D3/00
Domestic Patent References:
JPS63114882A1988-05-19
Attorney, Agent or Firm:
Osamu Nakahira