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Patent Searching and Data


Title:
GRINDING WHEEL BASE AND GRINDING WHEEL
Document Type and Number:
Japanese Patent JP2000288941
Kind Code:
A
Abstract:

To increase the hardness and reduce the weight by constituting a grinding wheel base from a Si-SiC composite material or SiC composite material.

This grinding wheel base 21 is formed of a Si-SiC composite material or SiC composite material. Since the Si-SiC composite material and SiC composite material are lighter in weight than aluminum, the energy quantity required for rotation of a grinding wheel 20 can be minimized in the use as the material of the grinding wheel base 21 to reduce the cost required for grinding. Further, since the Si-SiC composite material and SiC composite material are superior in hardness to iron, the biting speed of abrasive grains 22 to the grinding wheel base 21 can be delayed in the use as the grinding wheel base 21 to extend the life of the grinding wheel 20. Since the grinding wheel 20 can be rotated with a small quantity of energy without causing the biting of the abrasive grains 22, a high-speed rotation can be performed to improve the efficiency of grinding work.


Inventors:
HANZAWA SHIGERU
NAKANO KENJI
Application Number:
JP10049299A
Publication Date:
October 17, 2000
Filing Date:
April 07, 1999
Export Citation:
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Assignee:
NGK INSULATORS LTD
International Classes:
B24D3/00; B24D3/06; B24D3/28; (IPC1-7): B24D3/00; B24D3/00; B24D3/06; B24D3/28
Attorney, Agent or Firm:
Ippei Watanabe