Title:
HARD FILM, AND FORMING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2015157975
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hard film that is formed on a substrate surface of tools and is excellent in abrasion resistance and adhesion in cutting work or the like, and a forming method thereof.SOLUTION: A hard film 1 formed on a substrate 10 is composed of an A layer 4 having a composition of [Ti(BCN)] and a B layer 5 having a composition of any one of [TiAl(CN)], [AlCr(CN)], [TiCrAlSi(CN)], and [TiSi(CN)]. A base layer 2 composed of the B layer 5 is formed on the substrate 10 and an adhesion-promoted layer 3 laminated alternately and repeatedly with the A layer 4 and the B layer 5 is formed on the base layer 2. As the adhesion-promoted layer 3 gets thicker, the A layer 4 to be added gets thicker than the A layer 4 closer to the base layer 2 and reaches a maximum thickness of 20-50 nm.
Inventors:
NII HIROHIDE
YAMAMOTO KENJI
YAMAMOTO KENJI
Application Number:
JP2014032280A
Publication Date:
September 03, 2015
Filing Date:
February 21, 2014
Export Citation:
Assignee:
KOBE STEEL LTD
International Classes:
C23C14/06; B23B27/14; B32B15/01
Domestic Patent References:
| JP2013124405A | 2013-06-24 | |||
| JP2011083876A | 2011-04-28 | |||
| JP2010047797A | 2010-03-04 | |||
| JP2011083879A | 2011-04-28 |
Attorney, Agent or Firm:
Isono Dozo
Etsuo Tada
Tetsuo Tomita
Etsuo Tada
Tetsuo Tomita