Title:
METHOD OF RECOVERING SIVER SOLDER INGREDIENT FROM SIVER SOLDER CLADDING KOVAR
Document Type and Number:
Japanese Patent JP2015157976
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of recovering a silver solder ingredient from a silver cladding kovar through selective dissolution selectively by a simple dissolving method, while suppressing dissolution of kovar substrate ingredients, without an electrolytic treatment requiring a large-scale installation.SOLUTION: A silver solder ingredient is dissolved selectively from a silver solder cladding kovar by using a dissolving solution of diluted nitric acid containing hydrogen peroxide. Preferably, the dissolving solution used contains 8-10 vol.% of 67.5% nitric acid and 8-17 vol.% of 35% hydrogen peroxide, with respect to the total amount of the solution, and remaining water. For the solution temperature of the dissolving solution, the initial temperature at the start of dissolving is preferably 30°C or lower.
Inventors:
MAEBA KAZUYA
OKUBO MASAMUNE
YONEKURA SUSUMU
OKUBO MASAMUNE
YONEKURA SUSUMU
Application Number:
JP2014032539A
Publication Date:
September 03, 2015
Filing Date:
February 24, 2014
Export Citation:
Assignee:
OKUCHI DENSHI KK
International Classes:
C22B11/00; C22B3/04; C22B7/00; C22C38/00
Attorney, Agent or Firm:
Masao Yamamoto
Noriyuki Tsujikawa
Noriyuki Tsujikawa
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