Title:
FLUX SUPPLY APPARATUS
Document Type and Number:
Japanese Patent JP3147515
Kind Code:
B2
Abstract:
PURPOSE: To provide means for applying a suitable amount of soldering flux to a bump of a chip.
CONSTITUTION: The flux supply apparatus comprises a first storage groove 21 for storing flux 7 on an upper surface of a rotor 20, a second storage groove 22 for applying flux by landing a protruding electrode 2 of a chip 1 to be concentrically formed with the groove 21, scraping means 26a provided in the groove 21 to scrape up the flux stored in the groove 21 to be supplied to the groove 22, and a squeegee 11 provided in the groove 22 to smooth an upper surface of the flux stored in the groove 22. A small amount of flux is stably supplied from the groove 21 to the groove 22, a liquid level of the groove 22 is stabilized, and a suitable amount of the flux can be adhered to the bump 2.
Inventors:
Naoki Miyazaki
Application Number:
JP21896192A
Publication Date:
March 19, 2001
Filing Date:
August 18, 1992
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23K3/00; H01L21/60; H05K3/34; (IPC1-7): H01L21/60; H05K3/34
Domestic Patent References:
| JP4178264A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)