Title:
HEAD STACK ASSEMBLY MANUFACTURING APPARATUS
Document Type and Number:
Japanese Patent JP2016152053
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To solve such a problem that a process of fitting a slider to a suspension assembled to an E block, by adhesion is proposed, however, in the process of fitting the slider to the suspension already assembled to the E block, it is difficult to distribute fixing receiving parts for mitigating bending of an HGA (Head Gimbal Assembly) by force in a mounting direction applied to an HGA single body via an adhesion object when mounting the slider on the HGA single body.SOLUTION: The head stack assembly manufacturing apparatus according to the present invention for mounting a slider on a mounting face of a flexure, the attitude of which is controlled by a plate-like load beam including a load bending part and supported by an E block of the head stack assembly, includes a load beam support part for mitigating the bending of the HGA by force in the mounting direction when the slider is mounted. This configuration can accelerate crush of an adhesion object so as to shorten the mounting time.SELECTED DRAWING: Figure 3
Inventors:
KAWASHIMA TAKASHI
MIZUNO TORU
SUZUKI HIDETOSHI
HAYAMI KENICHI
MIZUNO TORU
SUZUKI HIDETOSHI
HAYAMI KENICHI
Application Number:
JP2015030223A
Publication Date:
August 22, 2016
Filing Date:
February 19, 2015
Export Citation:
Assignee:
TDK CORP
International Classes:
G11B21/24; G11B21/21
Domestic Patent References:
| JP2005158198A | 2005-06-16 | |||
| JP2009054256A | 2009-03-12 | |||
| JP2005135467A | 2005-05-26 |
Attorney, Agent or Firm:
Okabe
Shinichi Usui
Takao Ochi
Koji Yoshizawa
Masami Saito
Shinichi Usui
Takao Ochi
Koji Yoshizawa
Masami Saito
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