Title:
HEAT CONDUCTION MEMBER
Document Type and Number:
Japanese Patent JP2023123892
Kind Code:
A
Abstract:
To provide a heat conduction member which enables improvement of heat transport efficiency of a plate-like heat pipe.SOLUTION: A heat conduction member comprises: a housing 10 having an internal space 103; a first wick structure 31; a second wick structure 32; and a working medium 20. The housing 10 has: a first metal plate 11; a second metal plate 12 disposed facing the first metal plate 11; and pillar portions 13 disposed in the internal space 103. The working medium 20, the first wick structure 31, and the second wick structure 32 are disposed in the internal space 103. The first wick structure 31 is disposed on the first metal plate 11 side. The second wick structure 32 is disposed on the second metal plate 12 side. The second wick structure 32 has multiple openings 34 opened on a facing surface facing the first wick structure 31 and extending in a thickness direction.SELECTED DRAWING: Figure 2
Inventors:
ISHIDA JUNICHI
HANANO MASAAKI
KOSEKI TOSHIHIKO
NISHIKAWA KAZUHIRO
HANANO MASAAKI
KOSEKI TOSHIHIKO
NISHIKAWA KAZUHIRO
Application Number:
JP2021088007A
Publication Date:
September 06, 2023
Filing Date:
May 25, 2021
Export Citation:
Assignee:
NIDEC CORP
CHAUN CHOUNG TECH NOLOGYCORP
CHAUN CHOUNG TECH NOLOGYCORP
International Classes:
F28D15/04; F28D15/02; H01L23/427; H05K7/20
Attorney, Agent or Firm:
Patent Attorney Corporation Sano Patent Office