Title:
HEAT-CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2010278293
Kind Code:
A
Abstract:
To economically-advantageously and stably manufacture a heat-conductive film having both high insulation property and heat conductivity.
This heat-conductive film of a multilayer structure is manufactured by performing co-extrusion and film formation so that an insulation layer is arranged on one surface or each of both surfaces of a heat-conductive resin layer containing 10-90 vol.% of a filler having electric conductivity and heat conductivity. The resin constituting the heat-conductive resin layer is preferably a polyolefin resin, wherein the density, the DSC melting point and the bending elastic modulus of the polyolefin resin are preferably 0.85-0.90 g/cm3, 110-140°C, and 5-100 MPa, respectively.
Inventors:
KITSUTANI NOZOMI
UEKI TAKAYUKI
MITA KOZO
UEKI TAKAYUKI
MITA KOZO
Application Number:
JP2009130260A
Publication Date:
December 09, 2010
Filing Date:
May 29, 2009
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L23/36; B32B27/18
Domestic Patent References:
| JP2008205453A | 2008-09-04 | |||
| JP2009108264A | 2009-05-21 |
Attorney, Agent or Firm:
Satoshi Kanayama
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto